4 Advantages of Plasma Treatment

     Plasma cleaning:

remove inorganic substances or weak bonds and typical -CH-based organic pollutants and oxides on the surface of the base material.

Plasma cleaning is a proven, effective, economical, and environmentally safe method of critical surface treatment.

Plasma cleaning with oxygen plasma removes natural and technical greases at the nanoscale. It reduces contamination by up to 6 times compared to traditional wet cleaning methods, including solvent cleaning of the residue.

Plasma cleaning produces pristine surfaces that can be used for bonding or further processing without any hazardous waste.

Main features: It only reacts with the nano-thickness of the material's surface and does not corrode the interior, and the ultra-clean surface is obtained to prepare for the following process.

     Plasma activation:

chemical reaction with the matrix material to form three groups of C=O (Carbonyl), -COOH (Carboxyl), and -OH (Hydroxyl) on the surface. These groups have stable hydrophilic functions and have a positive effect on bonding.

Low energy substrates are gaining popularity in many manufacturing processes. These substrates offer the advantages of durability, flexibility, and cost-effectiveness.

However, while adhesives have adapted to the challenges posed by low surface energies, these substrates can also be tuned by plasma treatment.

Plasma provides an adequate surface activation pretreatment before printing, painting, or bonding.

Glass and ceramics can similarly undergo plasma activation.

Main features: It can make some active atoms, free radicals, and unsaturated bonds appear on the surface of the polymer. These active groups react with the active particles in the plasma to generate new active groups, thereby increasing the surface energy and changing the chemical properties of the surface. , enhance surface adhesion and cohesion.

       Plasma etching:

A gas-phase plasma with strong etching properties is formed by using a typical gas combination to chemically react with the base material to generate volatile gases such as CO, CO2, H2O, etc. purpose for etching.

Plasma etching is used to "roughen" surfaces on a microscopic scale. Etch the surface of the part with reactive process gases.

The material is precisely sputtered, converted into the gas phase, and sucked away by a vacuum system. The surface area is significantly increased, making the material easier to wet.

Etching is used before printing, bonding, and painting and is especially useful for processing such as POM and PTFE, which otherwise cannot be printed or bonded.

Main features: Selective etching; can effectively remove foreign matter on the surface to achieve ideal roughness.

Plasma coating (grafting, deposition):

two or more gases (or monomers) enter the reaction chamber simultaneously, and the gases will polymerize in the plasma environment. This application is somewhat more stringent than activation and cleaning requirements. Typical applications are forming protective layers for fuel containers, scratch-resistant surfaces, coatings of Polytetrafluoroethylene (PTFE)-like materials, waterproof coatings, etc.

In plasma coating, a nanoscale polymer layer is formed over the entire surface area of an object placed in the plasma.

The coating process only takes a few minutes.